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Job Description

FAST Labs is a world-class research organization. Our vision, We secure the future through fearless innovation, fuels our curiosity and propels our technical teams to take on never been done before challenges. FAST Labs advances science, develops technology, and delivers E products to solve the toughest challenges for our defense and commercial customers. FAST Labs defines the next generation of technology across BAE Systems Electronic Systems (ES) sector. We value internal and external partnerships and collaborate across a broad innovation ecosystem that includes DoD/IC/OGA labs and research teams, universities, small businesses and venture firms/accelerators all in service of developing advanced technologies to enable our nation s warfighting mission needs.

We are looking for a technical leader for our new Mixed Signal and Digital IC Design Capability Group (MS&DICD CG) for the FAST Labs Microelectronics Product Line. The Microelectronics team charter spans the full lifecycle from science and technology to design and development through production. We focus on wafer level and chip/module level products involving mixed signal and digital domains.

As the CG Lead, you will manage and direct a large team of custom circuit, logic design, verification, or implementation design engineers while remaining closely involved in the hands-on technical aspects of the design. The design team is geographically dispersed with some working fully remote. You will be involved with leading the team that continues to develop the most advanced mixed signal and radiation hardened microelectronics for applications across our Electronics Systems portfolio. The CG lead acts as an engineering partner to the Mixed Signal and Digital IC Product Group Director and Microelectronics Product Line Engineering Lead (PLEL). The CG Lead will collaborate closely with the MMIC and Foundry Capability Group to ensure smooth transitions to production and test. The CG Lead helps define technical strategies and roadmap for the capability group. The CG Lead provides engineering leadership for the team during all lifecycle phases (conception, design, development, production, and support). The CG Lead ensures that all aspects of the solutions design and development, including the application of core engineering processes, Design Reviews and Technical Bid Reviews, Test Readiness Reviews are appropriately tailored, deployed, and effectively performed within the product line.

The successful applicant will bring strong microelectronics design, production and test background; positive experience in contracted research & development (CRAD) leadership (shaping, capturing and executing CRAD); as well as product design and development applicable to hardware, software and/or algorithmic-based application solutions. Experience in both research and product development enables the successful applicant to know what is needed, and not needed, for success in an agile R&D business.

• Please note that pursuant to a government contract, this specific position requires US citizenship status

Specific Responsibilities Include:

• Partner with and support the Mixed Signal and Digital IC Product Area Director and staff to develop and deliver products and systems that meet our customer needs

• Responsible for all Engineering activities across the Mixed Signal and Digital IC portfolio; engineering staffing, proposal support, technology and product roadmaps, transition to production, and cost and schedule estimation.

• Ensure strategic tailoring and application of engineering process, in accordance with the Engineering Management Framework, based on the size, complexity, and risk of the project.

• Recruit, retain, train, recognize, develop, and assign team members as appropriate to meet business area needs

• Drive strategies for diversity, equity, inclusion (DEI) and other considerations for improving and optimizing organizational performance of a geographically dispersed team.

• Develop and maintain measures related to the engineering team s performance

• Support new business proposals, technical solutions and reviews

• Support continuous improvement activities and ensure adoption within the organization

• Establish and achieve engineering goals, performance standards, budgets, financial targets and staffing plans

• Demonstrate alignment with the sector s cultural principles and model safe and ethical behavior

Because this role involves a combination of collaborative/in-person and independent work, it will take the form of a hybrid work format, with time split between working onsite and remotely. This position will be located in Nashua, NH or Manassas, VA.

Required Education, Experience, & Skills

• Ability to obtain and maintain DoD TS/SCI and SAP clearances

• Bachelor's Degree with 12 years of experience in Mixed Signal IC or Digital IC Design and Production

• Expertise in an area of chip design (Logic Design, Verification, Design for Test, Implementation, Custom Circuits) for complex digital and mixed-signal applications (e.g. Processors, Memories, Libraries, IO, PLLs, SERDES, etc)

• Interacting with production/operations team to ensure chip manufacturability

• 4 years of experience in managing or leading engineering efforts in product development

• Highly tuned interpersonal skills: skilled at influencing and shaping others behavior and performance

• Proven performance in management, mentoring, coaching and communication

• Demonstrated critical thinking skills and decision-making abilit

Preferred Education, Experience, & Skills

• Active Top Secret/SCI clearance

• MS in Electrical or Computer Engineering with microelectronics focus

• Experience with and understanding of functional matrix organizations

• Proven track record of increasing responsibilities in managing organizations of significant complexity

• Significant prior work in advanced CMOS technologies

• Strong business acumen and presence at the leadership level

• Experience defining and driving professional/technical direction and strategy

• Testing experience with digital, mixed-signal, or analog circuits

• Proficiency with EDA IC tool suites: Cadence, Siemens, or Synopsys

• Familiarity with the mixed signal or digital chip product lifecycle

• Strong written and oral communication skills (including Microsoft Office

Pay Information

Full-Time Salary Range: $147300 - $250400

Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience.

Employee Benefits: At BAE Systems, we support our employees in all aspects of their life, including their health and financial well-being. Regular employees scheduled to work 20 hours per week are offered: health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance. We also have an employee assistance program, a legal plan, and other perks including discounts on things like home, auto, and pet insurance. Our leave programs include paid time off, paid holidays, as well as other types of leave, including paid parental, military, bereavement, and any applicable federal and state sick leave. Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards. Other incentives may be available based on position level and/or job specifics.

FAST Labs - Mixed Signal and Digital IC Senior Engineering Manager

99773BR

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