Northrop Grumman Sr Principal Microelectronics Semiconductor Process Engineer in Apopka, Florida
Northrop Grumman Mission Systems is seeking an exceptionally talented and resourceful engineer to lead wafer bumping processing for advanced semiconductor packaging. Northrop Grumman's semiconductor foundry and packaging lines are unique capabilities supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading edge technology development. Our devices enable a number of Northrop Grumman's ground based radars, avionic radars, and space systems.
The wafer bumping line, located in Apopka, FL, will support flip chip, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs. The line will provide a range of bump compositions, including tin/
lead, lead-free, microbumps, and copper pillar, using sputter, electro and electro-less plating, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging.
Join us for the chance for hands-on work with a small, experienced and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in production, R&D, ongoing long-term
programs, and new programs targeting future military platforms.
Overall ownership of multiple wafer bumping process flows.
Developing and leading qualification of new bump and microbump compositions and process flows.
Working with cross-site program, test, and reliability teams to achieve package qualifications and troubleshoot
manufacturing and development issues.
- Understanding program package requirements and advising on suitable bump metallurgies and process flows.
-Primary technical interface between wafer bumping line, site management, and internal programs.
-BS, MS or PhD in Electrical Engineering, Materials, Chemistry, Physics, or related technical discipline.
-At least 9 years of hands-on semiconductor packaging experience with a Bachelors degree.
-Experience in process integration and yield learning.
-Strong leadership and communication skills.
-Must be a US Citizen and able to obtain and maintain a Secret clearance.
-Deep understanding of UBM and solder bump metallurgy and how they impact package reliability.
-Hands-on experience with both lead and lead-free bump technologies.
-Experience in flip chip, 2.5D and 3D packaging.
-Broad knowledge of relevant semiconductor processes, such as electrochemical plating, electroless plating, contact
lithography and spin-on resists, wet chemical processing and etches, thin film sputter deposition, and ball drop processing.
-Experience in low volume/high product mix environments.
-Personal Clearance Level- Secret
-MS or PhD in Materials or Chemistry
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit www.northropgrumman.com/EEO . U.S. Citizenship is required for most positions.
Job Category : Engineering
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