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Job Description

Because this role involves a combination of collaborative/in-person and independent work, it will take the form of a hybrid work format, with time split between working onsite and remotely.

You don t see it, but it s there. Our employees work on the world s most advanced electronics from saving emissions in the City of Lights to powering the Mars Rover to protecting the F35 fighter jet. At Electronic Systems, you ll be among the brightest minds, working on the aerospace and defense industry s most difficult problems. Drawing strength from our differences, we re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first exemplified by our missions: We Protect Those Who Protect Us and We Innovate For Those Who Move The WorldTM. Sound like a team you want to be a part of? Come build your career with BAE Systems

In Navigation and Sensor Systems, we design and manufacture state-of-the-art systems and technology that enable our customers to execute their precision navigation missions.

BAE Systems is looking for an experienced Mechanical Engineer with a passion for engineering and the desire to work in the world of Microelectronics Packaging Design. Our team needs engineers interested in designing and developing the Microelectronics packages needed for supporting the next generation of Global Positioning (GPS) products and other platforms that support the war fighter. The position offers abundant opportunity to design and develop state of the art miniaturized electronic devices. As a part of this team, you will have responsibilities spanning all phases of the engineering life cycle including design, process development, qualification, and factory support. The successful applicant should be knowledgeable in microelectronics packaging concepts and technologies.

Primary Responsibilities:

• Contribute to program pursuits and bid estimates

• Participate in Microelectronics product development activities including packaging concept, preliminary/detailed board design and packaging road mapping efforts

• Develop technologies required for next generation packages

• Coordinate prototype package builds and evaluation efforts

• Qualify microelectronics packages

• Conduct failure analysis for microelectronics packages

• Support factory transition of products

• Provide manufacturing support for Microelectronics assemblies currently in production

Please note that pursuant to a government contract, this specific position requires US citizenship status

Required Education, Experience, & Skills

• US Citizenship

• All applicants must be able to obtain a DoD Security Clearance at time of application (REQUIRED)

• Bachelor's degree in Engineering with focus on Mechanical or Material Engineering and 10 years of direct related experienceor equivalent

Preferred Education, Experience, & Skills

• Microelectronics design and manufacturing assembly

• Microelectronics packaging materials and materials properties

• Electronic component reliability testing

• Post wafer fabrication processes

• Failure analysis techniques

• Additive manufacturing

• Wafer fabrication processes

• Advanced thermal packaging design

• RF packaging design

Pay Information

Full-Time Salary Range: $133333 - $226667

Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience.

Employee Benefits: At BAE Systems, we support our employees in all aspects of their life, including their health and financial well-being. Regular employees scheduled to work 20 hours per week are offered: health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance. We also have an employee assistance program, a legal plan, and other perks including discounts on things like home, auto, and pet insurance. Our leave programs include paid time off, paid holidays, as well as other types of leave, including paid parental, military, bereavement, and any applicable federal and state sick leave. Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards. Other incentives may be available based on position level and/or job specifics.

Senior Principal Mechanical Engineer - Microelectronics Packaging (Hybrid)

110596BR

EEO Career Site Equal Opportunity Employer. Minorities . females . veterans . individuals with disabilities . sexual orientation . gender identity . gender expression